Dt Sheet. The TOAB package is universially preferred for all commercial-industrial applications at power dissipation levels to approximately 50 W. The low thermal resistance and low package cost of the TOAB contribute to its wide acceptance throughout the industry. Repetitive rating; pulse width limited by maximum junction temperature see fig. B, Mar www.
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Vishay Siliconix. Q g Max. Q gs nC. Q gd nC. Lead Pb -free. The TOAB package is universially preferred for all. The low thermal resistance. Drain-Source Voltage. Gate-Source Voltage. Continuous Drain Current. Pulsed Drain Current a. Linear Derating Factor. Single Pulse Avalanche Energy b. Repetitive Avalanche Current a.
Repetitive Avalanche Energy a. Maximum Power Dissipation. Operating Junction and Storage Temperature Range. Soldering Recommendations Peak Temperature.
Mounting Torque. Repetitive rating; pulse width limited by maximum junction temperature see fig. Document Number: B, Mar This datasheet is subject to change without notice. Maximum Junction-to-Ambient. Case-to-Sink, Flat, Greased Surface. Maximum Junction-to-Case Drain. R thJA. R thCS. R thJC. Drain-Source Breakdown Voltage. V DS Temperature Coefficient. Gate-Source Threshold Voltage. Gate-Source Leakage.
Zero Gate Voltage Drain Current. Drain-Source On-State Resistance. Forward Transconductance. V GS th. I GSS. I DSS.
R DS on. Input Capacitance. Output Capacitance. Reverse Transfer Capacitance. Total Gate Charge. Gate-Source Charge. Gate-Drain Charge. Turn-On Delay Time. Rise Time. Turn-Off Delay Time. Fall Time. C iss. C oss. C rss. Internal Drain Inductance. Internal Source Inductance. Between lead,. L S die contact. Drain-Source Body Diode Characteristics. Continuous Source-Drain Diode Current.
Pulsed Diode Forward Current a. I SM p - n junction diode. Body Diode Voltage. Body Diode Reverse Recovery Time. Body Diode Reverse Recovery Charge. Forward Turn-On Time. The TOAB package is universially preferred for all commercial-industrial applications at power dissipation levels to approximately 50 W. The low thermal resistance and low package cost of the TOAB contribute to its wide acceptance throughout the industry. B, Mar www. B, Mar This datasheet is subject to change without notice.
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