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Dimensions in mm inches. TO—3 Metal Package. Pin 1 — Gate. Pin 2 — Source. Case — Drain. V DSS. I D cont. R DS on. Continuous Drain Current. Linear Derating Factor. Single Pulse Avalanche Energy 2. Avalanche Current 2. Peak Diode Recovery 3. Operating and Storage Temperature Range. Lead Temperature 1. Semelab plc. E-mail: sales semelab. No Preview Available!
Test Conditions. D T J Breakdown Voltage. Static Drain — Source On—State. R DS on Resistance 1. I GSS. Forward Gate — Source Leakage. Reverse Gate — Source Leakage. C iss. C oss. C rss. Input Capacitance. Output Capacitance. Reverse Transfer Capacitance. Total Gate Charge. Gate — Source Charge. Turn—On Delay Time. Rise Time. Turn—Off Delay Time. Fall Time. I S Continuous Source Current. Q rr Reverse Recovery Charge 1.
Internal Drain Inductance measured from 6mm down drain lead to centre of die. Internal Source Inductance from 6mm down source lead to source bond pad. Thermal Resistance Junction — Case. Thermal Resistance Case — Sink. Thermal Resistance Junction — Ambient. Part Number. View PDF for Mobile.
IRF430 MOSFET. Datasheet pdf. Equivalent
IRF430 PDF Datasheet浏览和下载