ASTM B488 PDF

ASTM E ASTM F ASTM D ASTM B

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Our sixty years of expertise in providing precision barrel, rack and vibratory gold plating is currently employed in numerous industries including the medical, telecommunications, aerospace and electronics industries. Advanced Plating Technologies has the ability to underplate with our various nickel plating services including both bright electrolytic nickel , sulfamate electrolytic nickel and electroless nickel deposits as well as copper plating or silver plating if required.

Gold plating has excellent electrical and thermal conductivity, offers exceptional solderability and is a superb reflector of infrared radiation.

In addition, gold is a noble metal that does not oxidize or chemically react under normal conditions. For this reason gold plating it is an exceptional choice for numerous engineering requirements where electrical conductivity especially at low voltages , solderability and corrosion resistance are design requirements.

Advanced Plating Technologies, a Milwaukee, Wisconsin company, offers gold plating in both Hard gold plating services are commonly employed in applications where repeated sliding or connection wear is a design consideration, such as in female to male interconnect pins or sprung contacts.

Our company offers hard gold plating that is alloyed with a small amount of cobalt to achieve the required deposit properties. Soft gold plating is commonly used where the highest of gold purity is required for soldering, wire bonding, high temperature or high corrosion resistance applications. The soft gold plating deposit provides an extremely pure deposit of gold, which maintains the low hardness, and high corrosion resistance of gold consistent with its elemental form. Soft gold plating is preferred for high temperature applications due to the fact that alloying elements of hard gold plating can oxidize at elevated temperatures.

The appearance of gold plating is very much a function of the underplate that is applied prior to deposition of the final gold layer. If a matte nickel such as sulfamate nickel is applied, the final gold deposit will have more of a matte appearance.

If a brightened nickel such as bright electrolytic nickel is utilized, the gold plating will have a bright appearance.

As with any deposit, the luster of the basis material has a large degree of correlation to the luster of the final gold plating. Our gold plating services are for commercial, high volume applications. At this time we do not offer electroplating on custom applications such as a watch, jewelry, silverware, etc. Gold plating services to AMS as well as most company-specific gold specifications can also be provided as detailed in our specification database.

Nickel Underplating is also applied for other reasons see Appendix X6. Type I — Grade C — Knoop hardness , incl. Grade D — Knoop hardness and over. Class 00 — 0. Underplate Requirements per section 6. Silver or copper plus silver may not be used unless required by item specification. A soft gold strike from a separate plating tank should follow any other undercoating and precede the final gold coating to improve adhesion and prevent contamination of the main gold plating solution by metallic impurities.

When applied to a copper rich surface such as brass, bronze or beryllium copper or a copper plate or strike, an antidiffussion underplate such as nickel shall be applied. Gold Plating Services — Gold Deposit Properties Gold plating has excellent electrical and thermal conductivity, offers exceptional solderability and is a superb reflector of infrared radiation.

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ASTM B488 Gold Plating Standard

Our sixty years of expertise in providing precision barrel, rack and vibratory gold plating is currently employed in numerous industries including the medical, telecommunications, aerospace and electronics industries. Advanced Plating Technologies has the ability to underplate with our various nickel plating services including both bright electrolytic nickel , sulfamate electrolytic nickel and electroless nickel deposits as well as copper plating or silver plating if required. Gold plating has excellent electrical and thermal conductivity, offers exceptional solderability and is a superb reflector of infrared radiation. In addition, gold is a noble metal that does not oxidize or chemically react under normal conditions. For this reason gold plating it is an exceptional choice for numerous engineering requirements where electrical conductivity especially at low voltages , solderability and corrosion resistance are design requirements. Advanced Plating Technologies, a Milwaukee, Wisconsin company, offers gold plating in both Hard gold plating services are commonly employed in applications where repeated sliding or connection wear is a design consideration, such as in female to male interconnect pins or sprung contacts.

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Historical Version s - view previous versions of standard. More B This specification establishes the requirements for electrodeposited gold coatings for engineering applications, employed specifically for their corrosion and tarnish resistance including resistance to fretting corrosion and catalytic polymerization , bondability, low and stable contact resistance, solderability, and infrared reflectivity. This specification does not cover gold coatings produced from autocatalytic, immersion, and vapor deposition.

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